JPH087635Y2 - Ｔａｂ式半導体装置の製造装置 - Google Patents

Ｔａｂ式半導体装置の製造装置

Info

Publication number
JPH087635Y2
JPH087635Y2 JP1990058399U JP5839990U JPH087635Y2 JP H087635 Y2 JPH087635 Y2 JP H087635Y2 JP 1990058399 U JP1990058399 U JP 1990058399U JP 5839990 U JP5839990 U JP 5839990U JP H087635 Y2 JPH087635 Y2 JP H087635Y2
Authority
JP
Japan
Prior art keywords
punch
inner lead
tab
semiconductor device
device manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990058399U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0415841U (en]
Inventor
啓司 柴田
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1990058399U priority Critical patent/JPH087635Y2/ja
Publication of JPH0415841U publication Critical patent/JPH0415841U/ja
Application granted granted Critical
Publication of JPH087635Y2 publication Critical patent/JPH087635Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1990058399U 1990-05-31 1990-05-31 Ｔａｂ式半導体装置の製造装置 Expired - Fee Related JPH087635Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990058399U JPH087635Y2 (ja) 1990-05-31 1990-05-31 Ｔａｂ式半導体装置の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990058399U JPH087635Y2 (ja) 1990-05-31 1990-05-31 Ｔａｂ式半導体装置の製造装置

Publications (2)

Publication Number Publication Date
JPH0415841U JPH0415841U (en]) 1992-02-07
JPH087635Y2 true JPH087635Y2 (ja) 1996-03-04

Family

ID=31583974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990058399U Expired - Fee Related JPH087635Y2 (ja) 1990-05-31 1990-05-31 Ｔａｂ式半導体装置の製造装置

Country Status (1)

Country Link
JP (1) JPH087635Y2 (en])

Also Published As

Publication number Publication date
JPH0415841U (en]) 1992-02-07

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